Bare board electrical testing system cause dents and damages to the tested pads by the pressure they apply by the testing pins. These dents often called witness marks can cause various difficulties during the assembly process in devices placement, soldering etc. I am looking for information regarding this matter: 1. Are these damages causing problems at the assembly process? what kind? 2. Are the damages affecting the assembly yield? 3. If yes, is there any data about the % of savings at the assembly stage if these damages are avoided? 4. Have the assebly people learn to live with these defects, overcoming the problems? what is the cost of such overoming? would elimination of these damages save money by avoiding to use these measures? 5. Will a contactless bare board electrical test system, causing no damage at all will be an advantage to assembly people? in what sense? 6. What would assembly people be will to do to push further such technology of bare board testing? David Banitt Exsight Ltd Israel ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################