We are having problems with via holes that are located directly on smt pads. During reflow the paste will flow away from the leads and collect insde of the via hole. We use water soluable paste, and a 6mil screen with the apertures reduced 10%. If anyone has any input on how to resolve this problem please reply. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################