Dear TechNetters ! Assuming that the boards are ordered and manufactured according to IPC-J-STD-003,but stored in a noncontrolled environment for more than 1 year, I would like help on the following-(for eutectic tin/lead): 1.What is the known growth rate of the intermetallic,and what is the minimum tin/lead thickness left? 2.If there is moisture absorbed,but the plating in holes is without defects concerning thickness,voids,drilling,a.s.o.,should I expect blowholes? 3.What is the maximum intermetallic growth after drying for 3 hrs at 120C? 4.Are delamination problems encountered in almost all or few boards which absorbed moisture ,and is this related more to the manufacturer's workmanship? 5.Finally would drying decrease solderability so much as to render boards unsolderable with no-clean fluxes? Could somebody give me some information very QUICKLY? Thank you all, GABY ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################