My company is a manufacturing company of PCB,specially for COB and BGA board. I have tested many brighteners of bright acid copper,but the copper deposits are all have meny small (1-5 um) nodules.After nickel and gold plating,these nodules will influnence the gold wire bonding.Is there any way to prevent or remove the nodules? Any new brightener of bright acid copper plating and methods of preveting and removing would be welcomed. Jing Li Fang Pricipal engineer Gul Technologies Singapore Ltd Tel:(65)8624095(DID) Fax;(65)8615519 E-mail:[log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################