My company is a manufacturing company of PCB,specially for COB and BGA
board.
I have tested many brighteners of bright acid copper,but the copper
deposits are
all have meny small (1-5 um) nodules.After nickel and gold plating,these
nodules
will influnence the gold wire bonding.Is there any way to prevent or remove
the
nodules? Any new brightener of bright acid copper plating and methods of
preveting
and removing would be welcomed.

Jing Li Fang
Pricipal engineer
Gul Technologies Singapore Ltd
Tel:(65)8624095(DID)
Fax;(65)8615519
E-mail:[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################