I'd like to throw out one more issue: 4- Can reliability of BGA's (or any other plastic parts for that matter) be compromised by exposure to cleaning solvents or solutions? > ---------- > From: Blanchet,Richard[SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;Blanchet,Richard > Sent: Wednesday, February 04, 1998 10:46 AM > To: [log in to unmask] > Subject: [TN] Assy: PBGAs > > Hello, > > As we hear more and more about BGAs, my perception is that there's > some > issues to be improved. From a military/high-end commercial application > stand > point, I have the following questions: > > 1- Do people put a lot of vias under BGAs to perform ICT or do they > just > perform functional tests ? > > 2- How do you guys inspect your BGA solder joints once on the card ? > Are > X-ray practical and reliable in a production mode ? What about > Scanning > Acoustic Microscopy (like a system from Sonoscan) ? > > 3- And what about repairs ? Are they easily done with a high success > rate ? > > I'm trying to learn anything I can about BGAs, so any info is welcome, > even > the most basic ones. > > You can reach me off-line at [log in to unmask] > > Thank you. > > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################