Wolfgang; take a look at the attached (rough) sketch - is this what you are trying to describe? If so, the only way that I ever eliminated or reduced this problem was to add a microetch step following the acid cleaner in the electrolytic copper preclean line. If you don't have a tank available, you can always add .25%-.5% v/v hydrogen peroxide to the sulfuric dip tank. The amount of peroxide that you drag into the copper bath is so small that you won't harm the brightener. You really have to watch the dwell time... Hope it helps; Fred J. >>> "Erat, Wolfgang" <[log in to unmask]> 02/27/98 01:36pm >>> We have a customer which is very sensitive to separation between plated copper and outerlayer foil copper (doublesided product). This condition is especially visible at high pad rotation after thermal shock. What can be done to minimize / avoid this issue ? Wolfgang Erat / Viasystems Canada ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################