It has been my understanding that this is a normal practice and should not be a problem. That is to say I have never had any quality issues with PCBs made this way.
Gary
At 10:51 AM 2/19/98 -0800, you wrote:
>One of my pcb vendors (oversea) wants to fabricate boards
>using electrolytically deposited gold (1um of Au over 5um of Ni)
>over entire board surface. That includes hole walls, soldering
>pads, conductive traces and ground planes. SMOBC is out the
>window and silkscreen/LPISM are last steps in board fabration
>process.
>
>This is first time that I was informed that a board vendor
>fabricates boards by depositing gold/nickel over entire board
>surface. My questions are:
>
>What negative effects will it have for smt and th board assembly
>manufacturing?
>Are smt/th process parameters req to be readjusted such as
>reflow profile?
>Will it increase diffusion of gold in solderpot?
>Will it increase solder joint brittleness?
>Are there long-term reliability issues?
>Is there any other negative issue that need to be addressed?
>
>There's no qualm about price. It is better than SMOBC boards
>with electroless Au/Ni immersion on soldering pads.
>
>regards
>Matthew Park
>NII Norsat International Inc.
>
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0000,0000,ffffGary Griffin
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