Chris Smith said: > My company is contemplating switching to the sls65 flux for our wave > solder processes. We are currently using Alpha Metals NR210X no > clean, but are not completely satisfied with the results. A year or > so ago (before I came on)the company ran a 55 gallon drum of SLS65 > flux through one of our solder waves. From what I've heard and read > it was a tremendous success with eliminating solder defects (mainly > solder balls). However, I myself have no history with this flux and > was hoping that some of you who do can give your input. Please let me > know what you think. > > Thanks > Chris Smith M.E. We are evaluating the Alpha (Lonco) SLS 65 and SLS 26 F. These are similar J-STD-004 ORM0 low solids products, designed for no-clean processing. Alpha literature states that SLS 65 was developed "to eliminate the tendency for solder balling and solder bridging". IMO, it has some carrier properties which help to "survive" a chip wave, and to reduce the bridging tendencies in a dual wave setup, especially. We liked the soldering results. The residue is sort of "oily" in nature, and will be mobile when handling boards. This was applied with a foam fluxer here, and probably would give better results if sprayed. The similar SLS26F seems to exhibit a bit less of this survival, and perhaps you could look at this. Datasheets I have indicate both SLS 65 and SLS 26 F pass the Bellcore SIR and EMR requirements. Alpha also has an NR310H "VOC-free" (ORM0) which they claim will improve soldering bridges. It does not pass the Bellcore SIR requirement. We have not tested this product yet. I suggest you contact Jim Norris at Lonco - Bensenville, IL at 630-766-5902 for further details. regards, Jerry Cupples Interphase Corporation Dallas, TX USA http://www.iphase.com ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################