When you are using a metal squeegee does more pressure still yeild less
solder paste?  If so, could anyone tell me the phenomenon of why this
is?

And,  would you say it is better to have one set speed for squeegee
blade travel, and only vary the squeegee pressure?


And if you use one set speed should you have one set speed for each
array of pitches,  i.e. .025" and less 25mm/sec, .026" to .036" 35mm/sec
(or whatever), or just have one set speed for all lead pitches?

Thanks in advance for your thoughts on these questions.

Kathy Palumbo

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