Note that there exist cost effective ED foils that perform well in low cycle/flex to install applications. These ED foils should not be used in High Cycle applications. Jonathan Meigs Oak-Mitsui ---------- >>>From: Shaddock, David M (CRD) >>>To: [log in to unmask] >>>Subject: Re: [TN] electrodep Cu foil vs. RA foil >>>Date: Wednesday, February 11, 1998 11:11AM >>> >>>The Merix article submitted by Paul Formiller mentions the grain >>>structure difference of RA vs ED foil that is important when >>>considering flex circuits. The vertical structure of the ED foil on a >>>flex circuit makes it more susceptible to failure when flexed than RA, >>>electroplated, or sputtered copper. >>>Dave Shaddock >>>GE >>>> ---------- >>>> From: Josh Moody[SMTP:[log in to unmask]] >>>> Sent: Monday, February 09, 1998 6:00 PM >>>> To: [log in to unmask] >>>> Subject: [TN] electrodep Cu foil vs. RA foil >>>> >>>> Technet, >>>> >>>> Can someone out there explain the difference between >>>> rolled/annealed copper foil and electrodeposited copper >>>> foil? also what are the cost and availibility issues >>>> with both, specifics are not needed only multipliers >>>> (i.e. RA foil is half the price ED foil) >>>> >>>> Thanks, >>>> >>>> >>>> Josh Moody >>>> Materials Quality Engineer >>>> Hewlett-Packard - Richardson (HPSD) >>>> ph# (972) 497-4617 >>>> [log in to unmask] >>>> >>>> ################################################################ >>>> TechNet E-Mail Forum provided as a free service by IPC using >>>> LISTSERV 1.8c >>>> ################################################################ >>>> To subscribe/unsubscribe, send a message to [log in to unmask] with >>>> following text in the body: >>>> To subscribe: SUBSCRIBE TechNet <your full name> >>>> To unsubscribe: SIGNOFF TechNet >>>> ################################################################ >>>> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for >>>> additional information. >>>> For the technical support contact Dmitriy Sklyar at [log in to unmask] >>>> or 847-509-9700 ext.311 >>>> ################################################################ >>>> >>> >>>################################################################ >>>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c >>>################################################################ >>>To subscribe/unsubscribe, send a message to [log in to unmask] >>>with following text in the body: >>>To subscribe: SUBSCRIBE TechNet <your full name> >>>To unsubscribe: SIGNOFF TechNet >>>################################################################ >>>Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. >>>For the technical support contact Dmitriy Sklyar at >>>[log in to unmask] or 847-509-9700 ext.311 >>>################################################################ >>> >>> ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################