I am familiar with ASM Hongkong and had oppurtunity to visit their plants in Europe and HK. ASM is very reliable alternative for Stamped leadframes, die and wire bonders and mold&die tools.We had opted for ASM die bonders ; mix of ASM and K&S wire bonders ; mix of ASM and K&S mold and die toolings. ASM was selected due to cost effectiveness --Technology is changing so fast that most of such machines are obsoleted within 3-5 years. Kulickke and Soffa (K&S) Asia Ltd is in HK. I had oppurtunity to survey equipment vendors in Europe and Hongkong in 1990. As per my findings, I rate as follows: 1. Die bonders: Alphasem....Switz. 2. Ball bonders: Esec --Switz. However, machine costs are pretty high. ASM is wrt cost (almost half) and quite reliable, flexible. 3. Wedge bonders: K&S and ASM are good competitors--K&S is better off with 1470 series. 4. Ovens:We used Heraeus. I 0have no experience with Delvotech. If you need more info on mold and die tools, Give me a call. Ashok Dhawan P.Eng. Manuf Engg 204-257-9199 fax 204-257-9104 ---------- > From: Jeff Wold[SMTP:[log in to unmask]] > Sent: January 22, 1998 4:29 PM > To: [log in to unmask] > Subject: [TN] F&K & ASM equipment feedback > > Jeffrey R Wold > 01/22/98 05:29 PM > We are in the processes of evaluating some equipment from F&K Delvotek > (Germany) and ASM Pacific (Hong Kong) and are looking for any > information > or experiences with either the equipment or the company in general. > Specifically we are a looking at the die bonders from both companies, > automatic wedge bonder from F&K, the automatic ball bonder from ASM, > and a > cure oven from ASM. > > Information that would be most helpful would about: > * Reliability > * Willingness and quality of custom modifications > * Ability to meet commitments > * Communications and technical support > or any other information that you would be willing to share that may > help > us in our selection process. > > Thanks in advance, > > Jeff Wold > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV > 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional information. > For the technical support contact Dmitriy Sklyar at [log in to unmask] or > 847-509-9700 ext.311 > ############################################################## > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################