David I would be happy to give a paper on the US (or world) market for PCBs. Global econoomy End market drivers Semiconductors Size & Scope of the PCB industry I can supply an abstract if you think this will fly. Walt ------------------------ From: David Bergman <[log in to unmask]> Subject: [TN] Call for papers Joint European Conference VII Date: Wed, 21 Jan 1998 15:42:10 -0600 To: [log in to unmask] European Joint Conference VII Paris, June 2-3, 1998 The New Role of PWB's in the Electronics Supply Chain CALL FOR PAPERS The EIPC, PCIF and IPC are pleased to host the seventh joint European Conference at the Hotel Sofitel in Paris. The theme of this year's event is the changing role that the PWB is having in today's electronics manufacturing environment. Density pressures from the hand-held market have pushed a number of companies to explore new manufacturing technologies. Now companies designing high performance workstations are looking to take advantage of increased routing capabilities as well. EJC VII will be your opportunity to participate in the latest developments. Design · Bringing process innovation into advanced PCB designs · Transmitting information across the electronics supply chain · Advanced data transfer methodology · Design for manufacturing/Testability Future manufacturing technologies · Revolutionary PCB manufacturing methods · Semiconductors-influenced manufacturing technology · Direct writing, laser technology, Optoelectronics circuits, etc. · Integration of PCB/ packaging, 3D organic packages, etc. · Developments in MCM-L, BGA, micro-BGA and other Chip Scale Packages, Direct Chip Attachment, Chip on Board, etc. Microvia Technology · User experience and new developments in laser via technology · User experience and new developments in photo via technology · Marketing aspects in the development of microvias · New materials for advanced build-up techniques · Process improvement in microvia-related processes (metallization, test, etc.) Multi Layer Technology · Materials and Process improvement in MLB production process · Fine-Line and High Density standard multilayers Double-Sided and Single-Sided technology · Materials and Process improvement in SS/DS production processes · Alternative PCB fabrication process for SS and DS Flexible/special PCB¹s · New materials, processes and applications for flexible interconnects · Innovation in Flex-Rigid, Multiwire technology Marketing and Management · Mergers and Acquisitions, industry restructuring · One-stop shopping concept · How to finance investments for future technology · Increasing profitability in the I&P industry · Innovative ideas in personnel management · TQM and IQA · European and World markets · Technology/market roadmaps · Process/financial benchmarks End User and CEM issues · Contract Assembly or Electronics Manufacturing Services (EMS) and their impact on the PCB supply chain · Evolution of the various OEM end-markets: Telecom, computer, automotive, industrial, consumer electronics, military. Environmental protection · Lead less electronics: alternative finishing, soldering, etc. · Recycling of liquid effluents/solid waste · Innovation in regenerating solutions, water treatment plants, etc. · Efficient metal recovery in the PCB industry · European legislation and its impact on the I&P industry OR ANY INNOVATIVE PRESENTATION ON TECHNICAL & MARKETING ISSUES IN THE INTERCONNECTION & PACKAGING INDUSTRY The Place The conference is scheduled in the Hotel Sofitel in Paris. Speakers to EJC VII are, as usual, offered free access to the conference, Gala dinner, proceedings and one hotel night. How to submit a paper. Please submit your title and abstract (max: 500 words) to: EIPC Att: Eric Toumieux Hegenheimermattweg 65, 4123 Allschwil Switzerland Tel: ++41 61 482 39 00 Fax:++41 61 482 39 10 E-mail: [log in to unmask] Deadline Deadline for abstracts is February 15, 1998 Deadline for submission of final Camera Ready paper to the EIPC office is May 1, 1998. ABSTRACT FOR EUOPEAN JOINT CONFERENCE VII "The New Role of PWB's in the Electronics Supply Chain" Company: Address/Tel/Fax: Name of Speaker: Title of Paper: Abstract: (you may use additional space if necessary) Please return to EIPC by February 15, 1998 ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ############################################################## ---------------End of Original Message----------------- -------------------------------------------------------- Name: Walt Custer E-mail: [log in to unmask] or [log in to unmask] Business: http://www.mortonintl.com/chem/elec/overelec.htm Personal: http://www.cursiter.com Date: 01/21/98 Time: 14:30:46 -------------------------------------------------------- ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################