Technetters,
In an attempt to reduce solder bridging between P-T-H leads one of
our employees raised the temperature on the solder pot of our wave
solder
machine. While this did alleviate most of the bridging effecting the
boards,on one board type, a multi-layer board, we ended up with numerous
overheated joints. Unfortunately it effected 27 boards, which for our
small shop would be a large amount of rework.

Reviewing both A-610 and J-STD-001 we didn't see anything that called
this out as a defect to rework or even a process indicator. Is this
correct?
Thanks for your help.
Tom Moore

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