Hi everyone,

I was wondering if there anybody could share with me any information or
suggestion related to via size, trace width and spacing optimization
applicable to the thickfilm process. I mean techniques that will allow a
design to beat 10 mil trace width and 10 mils spacing between lines.

Some techniques may be useful (diffusion patterning, etching, mesh size and
new pastes) for both (via and lines) but I do not have any information on
that. If you do so, I will appreciate having that. If there is anything else
to achieve that, I'm also interested.

Thanks in advance

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