Bev: Could you please elaoborate on what you mean by the Total pad mating area ? Is it the footprint surface area of the component leads or is it the total board pad surface area ? Regards Krishna >Joe Belmonte and Phil Zarrow give a formula for determining the >maximum weight of a secondary side SMT component in an article in >Circuits Assembly, September 1996. The formula is: Weight of >component in grams/Total pad mating area in square inches must be >less than 30. Perhaps your part is too heavy? Or is this a component >that you have been soldering successfully for some time, but can't do >now? Has your process changed (higher temperature, less surface >tension), higher air flow in oven, conveyor shudder? Good luck. > >Bev Christian >Nortel ______________________________________________________ Get Your Private, Free Email at http://www.hotmail.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################