Andrea, We have had great success using stock .062" thick PWB material as card carriers. We also have more of a high-temp material that has proven to withstand many reflow cycles. I even use our board router to fabricate the carriers, which is a plus since I can fab everything in our department cheaply. Then we put press-fit pins in to locate the boards. We normally use this method to add extra support for board assemblies that are .020"-.035" thick, but it could be utilized for your function. The obvious concern I would have with 1\4" thick stock is all that mass effecting your reflow profile...if you are running forced air convection, it is a little less of a concern, but still going to effect your profile/reflow greatly. Feel free to call me directly if I can answer specifics for you. At 04:37 PM 1/23/98 -0500, you wrote: >I would like some help on finding a good material for making card carriers >to go through the reflow oven. We will be assembling a card with PTH >connectors on both sides and will use the paste in hole process. The >carrier would hold the bottomside connectors and support the board but >cannot absorb too much heat to affect reflow. I have heard of ECP Plus >from EMC and Delmat for making wave solder card carriers. Are those >materials good for reflow as well? Is there anything better, less >expensive, easier to machine, etc. out there? I would like to get the >material in approximately 1/4" thick sheets and then have them milled out >in our machine shop. You can e-mail me directly at [log in to unmask] > >Thanks for your input, >Andrea Shurtz >Lexmark Electronics > >################################################################ >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c >################################################################ >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: >To subscribe: SUBSCRIBE TechNet <your full name> >To unsubscribe: SIGNOFF TechNet >################################################################ >Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. >For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 >################################################################ > > > ---------------------------------- Jeff L. Hempton phone: (219) 429-7335 Fax: (219) 429-4688 Boardshop Manufacturing Engineer Mail Stop: 25-31 Raytheon Systems Company 1010 Production Road, Fort Wayne, IN 46808-4106 Email: [log in to unmask] "The man who rolls up his sleeves seldom loses his shirt."--Thomas Cowan ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################