Hello : Happy New Year to all of you. I am a process engineer trying to resolve the falling of a bottom side surface mount component during second pass of forced convection reflow. I am beginning to feel that the solderability of the component leads is getting reduced after the first pass of reflow and that is causing the part to fall. If any of you have had similar experiences, could you please share ? Your suggestions are welcome. Krishna Kalyan ______________________________________________________ Get Your Private, Free Email at http://www.hotmail.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################