Dear IPC experts: I am looking for information regarding J- leaded component ( SMD switches ) heights variation due to reflow soldering. We are using 6 mils stencil. The maximum allowed solder paste thickness is 8 mils. What could be the maximum solder thickness under the component's lead after reflow ? Any help would be greatly appreciated. Stella Neyman ASD, Eaton Corp. 248-608-7289 ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################