Over the past 2 months we have been experiencing and increase in the number of opens on several different fine pitch QFPs. We believe the problem is due to poor wetting to the component leads. On a typical 304 QFP we find ~ 5-10% of the cards have 1 or more lead which is open. Optically the open lead has a coarse, grainy finish, and is surrounded by good joints where the lead finish has a very fine grain structure. SEM/EDX analysis of the finish reveals the presence of large (~20-40 um) Sn grains with Pb segregated between the grains. Analysis has not shown any signs of gross contamination. Is there anyone who has seen a similar phenomena and might have a possible corrective action? I can email anyone a picture if you're interested. Thank you Jason Bragg Jason P. Bragg, Celestica Inc. Component Failure Analysis 844 Don Mills Road, 20/429 Materials Analytical Lab North York, Ontario, M3C 1V7 Internet: [log in to unmask] Tel: (416) 448-6203 ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################