IPC-2225 (e)
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

This standard establishes requirements and other considerations (thermal, electrical,
electrochemical and mechanical) for the design of organic mounting structure used to
interconnect chip components, which in combination form the completed functional
single Chip Module (SCM-L), MCM, or MCM-L assemblies.
Released May 1998.

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