The 4th Annual IPC/SMTA National Symposium on Ball Grid Array conference proceedings are now available. The proceedings are from the conference held on May 19-20 in Minneapolis, MN as part of the Midwest Electronics Expo. It consists of a two-volume set and one supplement paper. The two-day symposium explored all aspects of BGA technology: assembly, testing, repair, and reliability issues. Experts representing these and other concerns present their latest findings. Released May 1998. Volume 1: 88 pages Volume 2: 114 pages IPC Member: $50 Nonmember: $100 ################################################################ IPC_New_Releases E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE IPC_New_Releases <your full name> To unsubscribe: SIGNOFF IPC_New_Releases ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################