The 4th Annual IPC/SMTA National Symposium on Ball Grid Array conference proceedings
are now available.  The proceedings are from the conference held on May 19-20 in
Minneapolis, MN as part of the Midwest Electronics Expo.  It consists of a two-volume
set and one supplement paper.
The two-day symposium explored all aspects of BGA technology: assembly, testing,
repair, and reliability issues.  Experts representing these and other concerns
present their latest findings.  Released May 1998.
Volume 1: 88 pages      Volume 2: 114 pages

IPC Member: $50           Nonmember: $100

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