Bill, Not necessarily true. With regards to which method is best, Batch or In-line, EITHER process is great. Consider this, Enthones patented method is an Automated In-line Process that submerges the entire PCB in Entek Plus Cu-106A. The prior and post steps are Spray bar (e.g. Soak, Microetch, Acid Dip, etc.). The important consideration here is Solution Temperature and utmost, the dwell time. Regardless of what method is used, the dwell time will make or break the assembler (your customer). A nominal OSP thickness should be .2-.5 microns. Perform a coupon test and verify via a Spectrometer method. Again, either process will work, provided the latter items are monitored. With regards to Thermal Excursions, I do not recommended a bake following an OSP application. A board bake to remove moisture prior to typical Assembly process is not the same. Consider this, a typical bake is 1-2 hours @ 110°C (230°F), again dependent on the oven convection. The Thermal Excursions encountered in Assembly are quick with respect to a bake. Reflow is typically 5 minutes max per side and same for Wave Solder (pre-heat plus solder pot) and then consider the 130°F wash should you use an OA (Water Soluble Paste). Maybe someone else can answer this, what Temp/time ratio is equivalent to removing "X" OSP thickness. There are alternative methods for monitoring moisture absorption at the Fabricator. John Gulley Inet Inc 972-578-3928 [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: [TN] Re[2]: [TN] entek plus process Author: [log in to unmask] at Internet