Jim, we have good experience with Dow Corning Q1-9226. It is a well established, pasty, 2 component, alumina filled, heat curing (at least 100°C, up to 200°C for snap curing) silicon adhesive with a pot life (after mixing 1:1 by weight) of about 8 hours. As it is from the addition curing type, it does not generate byproducts during curing. As the coherent force (the inner rigidity of the glue) is lower than the adherent adhesion force, one can increase lap shear forces far above the values given in the data sheets by making the glue film as thin as possible (lower than 50 micrometers). This also will give you low thermal resistivity. Hope that helped a little U. Korndörfer (not working for or associated with Dow Corning) ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################