Sorry , I do not like to create any controversy about electroles copper and electroplated copper from physical properties point of view..but fact of life of manufacturing on floor that.....( and no body can deny..) 1. All data provided , created by vendor , prepared under strict cintrol condition which hardly gets repeatd in shop. 2. Electroless copper is always spongy, etch off two to three faster than electrolyic copper in microetch 3. Electroless copper grain structure varies from bath to bath, chemistry, and other combination of physical parameters controling the process from hour to hour. 4 Properties of electrolytic copper also varies similarly. 5. In microetch, electroless copper creates lot of mud like stuff means smut due to lot of organic material between/ in grain boundries. 6. Electroplated copper is dandrite as a foil copper and amorphous as plated on PCB and electoless with big grains which can judged from micro-section easily. 7. Definitly, there are changes in morphology of copper in PCB plating from time to time whihin acceptable limits of quality. Fulabhai [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################