Marcello: Yes, each thermal cycle will remove a small portion of the ENTEK-106A. However, ENTEK-106A will withstand 6-8 thermal cycles before it is sufficiently degraded to be of concern (and that is typically at 200+ degrees C.). In addition, the first thermal cycle actually makes it more chemically resistant. Since the typical process flow is either single reflow (1 cycle), dual reflow (2 cycles), single reflow with wave solder (2 cycles) or single reflow with Glue + wave solder (3 cycles), there is more than enough margin for a bake after ENTEK application. Right? Bill Fabry ______________________________ Reply Separator _________________________________ Subject: Re: [TN] entek plus process Author: "TechNet Mail Forum." <[log in to unmask]> at INTERNET