I would appreciate obtaining some sources for bumped flip chip devices. The requirement is for 3000 non specific devices with tin lead terminations. If any one has some contacts please let me have full details Tel, fax, email. Many thanks. "THE SOLUTION PROVIDER FOR YOUR MANUFACTURING PROBLEMS" Bob Willis Process Engineering Consultant Electronic Presentation Services 2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England. Tel: (44) 01245 351502 Fax: (44) 01245 496123 Mobile: (44) 0860 775858 Email: [log in to unmask] Internet Home Page: http://www.bobwillis.co.uk ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################