We have experienced isolated incidents of large pin count, 20 mil QFP's with vertically non-planer lead forms, resulting in solder fractures after reflow. We have determined that our processes are not inducing the failures and the part vendor claims no responsibility for the planarity issue. I'm interested in knowing if any one out there is using a reliable inspection process at incoming to audit their parts which does not impose the possibility of damaging the leads in and of itself? I don't want to handle the parts any more than necessary, but need some way to ensure that bad parts don't get to the placement machine. Jim ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################