We have experienced isolated incidents of large pin count, 20 mil QFP's
with vertically non-planer lead forms, resulting in solder fractures after
reflow.  We have determined that our processes are not inducing the
failures and the part vendor claims no responsibility for the planarity
issue.

I'm interested in knowing if any one out there is using a reliable
inspection process at incoming to audit their parts which does not impose
the possibility of damaging the leads in and of itself?  I don't want to
handle the parts any more than necessary, but need some way to ensure that
bad parts don't get to the placement machine.

Jim

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################