At 10:23 PM 1997/12/7 EST, you wrote: >Assuming your developing process is in spec, soldermask residue is indicative >of too high a temperature at tack cure; overexposure could also cause the >problem. > >Where is the residue? Is it on the fiberglass or the copper or both? >Give me your process parameters and I'll try to help. > >Mark Dowding >Regional Technical Service Manager >INSULECTRO > Thank you for your quick suggestion, for the parameters you need, I have to ask for our Engineers, once when I get it, I'll send to you. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################