Steve, Went through similar steps about seven years ago, so details are lost but some theory remains. Our findings were that the torque test was invalid because we were testing cured adhesive at room temperature. The failure mode is a preheated board hitting reflow or wave pot temperature. So, first, are you testing for the correct failure? In the end, we finally found an adhesive that did not degrade as bad when heated (never found what we wanted) and started controlling our adhesive application process closer using positive displacement pumps. On some heavier components that required more adhesion, we even placed adhesive at the outline edges of the part so when placed and pressed into the adhesive it would wrap around the outside edge and virtually clamp the part. Agree with the matte finish mask, we even roughed part surfaces, but in the end, the adhesives just didn't like getting heated. I would hope the adhesive mfgrs would have better products available after this much time though. Thats where I'd spend my time. Good luck, Jeff ---------- ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################