We do use via-in-pad technology for our BGA components.  Our boards are
designed, however, with a thin layer of polyimide which is bonded to the back
side of the multilayer board.  During the bonding process, the vias get filled
with resin.  We then require our suppliers to copper plate over the resin
filled vias then solder coat.  The result is a solid surface mount pad with a
via inside which is undetectable.

Jim Marsico
(516) 595-5879
[log in to unmask]

                        ********************************
                        *       ______   _   _  _____  *
                        *      / ___  | | | | | _____  *
                        *     / /___| | | | | | _____  *
                        *  __/  ____  | | | | |______  *
                        * |____/    |_| |_| |________| *
                        *                              *
                        *         SYSTEMS, INC.        *
                        ********************************

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################