I am getting confusing responses from a board vendor that uses in-line process, and from a board vendor that uses dipping process to coat boards with Entek Plus. What are advantage/disavantage using either process? What are problem associated with boards that were fabricated using dipping process? Does in-line processing provide better consistent and controllable coating (typ: 0.35um) than dipping process? Is there any other coating thickness measurement technique used by board vendors other than the sampling method specified by Enthone using UV spectrophotometer? What are some of inspection method employed by board vendors to check boards are coompletely dry prior packaging and shipping? advance thanks regards Matthew ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################