Plating: low electroless with flash plate Vs. Heavy electroless Now a days , both methods are successful . It depends upon degree of confiedence developed in final tune up of process, success rate , operator understading, other availibility of cleaning equipments, attitude not to change anything if it works good etc. It varies from shop to shop as part of integrity of process. Heavy electroless requires very tight lab. control. It has own problems,sometimes more problems for high plating rate. Medium plating bath are reasonably controllable. Low plating baths are very friendly, which requires flash plate... Another important thing is how you control microetch after acid cleaner in order not to have VOIDS.Every shop has own way of life...There is no rational one point answer. Personally, I prefer medium plating rate bath,to deposit 50 microinches of copper , no flash plate, tightly controlled microetch...and it works beautiful... ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################