Sheila, Its not always just an issue of too much heat, many times its an error in how the heat is applied. Often I see soldering irons resting on pads when attempting to heat a large component rather than placed on the component lead. (Always like to mention cause analysis) The damage progression I have observed is as follows: 1) Slight lifting of outer pad edges 2) Pad appears to start floating, edges curl up 3) Discolor and bubbling of adhesive and board surface 4) Separation of the pad from the barrel 5) Burning of board around pad (dry, flaking residue) When breaking of the board fibers occurs (white spots, delam), I have always found there was a physical inducement : trying to force a lead that is too large into the hole, pulling a clinched lead through the hole. Hope this helps Jeff [log in to unmask] ---------- From: Sheila Smith To: [log in to unmask] Subject: Re: [TN] hand soldering on wave soldered board