Robert and Jim, Being new to this 'SMT' stuff, I would also be interested in following this thread, here on the forum if appropriate and feasible. Thanks. Richard Hamilton Clemar Mfg. / Rain Bird > -----Original Message----- > From: Furrow, Robert Gordon (Robert) [SMTP:[log in to unmask]] > Sent: Monday, December 01, 1997 10:25 AM > To: [log in to unmask] > Subject: Re: [TN] Via in Pad for BGA > > Jim, > I would be very interested in learning more about this process. Do you > have several board suppliers that provide this for you? How much of a > cost adder is it? What is the smallest hole that can be filled and > plated over? Could you give me a more detailed explanation of the > polyimide bonding? What type of product has this process been used > for > (is it BellCore applicable)? Any further info you could give me would > be > greatly appreciated as we would like to fill and plate vias on some of > our product. My email is [log in to unmask] and my phone is > 978-960-3224. > Thanks in advance, > Robert Furrow > > >---------- > >From: Jim Marsico 516-595-5879[SMTP:[log in to unmask]] > >Sent: Monday, December 01, 1997 10:21 AM > >To: [log in to unmask] > >Subject: Re: [TN] Via in Pad for BGA > > > >We do use via-in-pad technology for our BGA components. Our boards > are > >designed, however, with a thin layer of polyimide which is bonded to > the back > >side of the multilayer board. During the bonding process, the vias > get > >filled > >with resin. We then require our suppliers to copper plate over the > resin > >filled vias then solder coat. The result is a solid surface mount > pad with a > >via inside which is undetectable. > > > >Jim Marsico > >(516) 595-5879 > >[log in to unmask] > ################################################ ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################