We are a small PCB assembly facility for mostly thru hole, but have a nice repair station for our surface mount technology. We normally order our components and wire with requirements for solderability conforming to MIL-STD-202 Method 208. We are increasingly being told by our distributors that the industry is moving away from these types of requirements. I can hardly believe that solderability is being phased out, but is there a more current IPC or industry specification or standard for solderability. It's hard to know what the larger organizations are doing. I would appreciate any feed back on this. Thanks Thank You, Darrell Bonzo EDO Corporation/Acoustic Division Tele. 801-486-7481 Ext. 329 Fax 801-486-1447 E-Mail [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################