We monitored our pot for a time (couple months or longer if necessary)
     by sending in solder samples for analysis.  As the data were returned
     we plotted the data and the results told us when to perform a solder
     change.  After you have this initial data collection complete, you can
     pretty much tell when it's time for a solder change.  Solder pot
     maintenance (TPM) can now be planned.  If you are processing a lot of
     gold boards, you may have to change more frequently (check your data).
      Pot size will also depend on your frequency.  We have had ABA Inc.,
     and Kester do our solder sample analysis.

     Ron Hollandsworth
     ITT A/CD
     [log in to unmask]

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