We monitored our pot for a time (couple months or longer if necessary) by sending in solder samples for analysis. As the data were returned we plotted the data and the results told us when to perform a solder change. After you have this initial data collection complete, you can pretty much tell when it's time for a solder change. Solder pot maintenance (TPM) can now be planned. If you are processing a lot of gold boards, you may have to change more frequently (check your data). Pot size will also depend on your frequency. We have had ABA Inc., and Kester do our solder sample analysis. Ron Hollandsworth ITT A/CD [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################