Gentlemen, I am looking for advise, checkpoints, pit falls, etc. on double sided PCB assembly methods. I have recently been informed by our engineering department that we will be advancing our board circuit densities by extending our bottom side component population from simple chip cap/resistors to active integrated components. I would greatly appreciate a few words from anyone presently producing high density, mixed technology, double sided boards, that can provide process insights. Lee McCuistion Manufacturing Engineer Cubix Corporation 2800 Lockheed Way Carson City, NV 89706 702-888-1000 x237 (voice) 702-888-1002 (fax) [log in to unmask] (e-mail) ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################