Resin Starvation is one of my current concerns. It is not addressed in the bare board specifications because it is not supposed to be present in laminate. However I don't see it specificately addressed in the laminate specs either. If it is present in laminate it can result in failures in the bare boards due to electrochemical migration. Since the bond between resin and glass is poor, any liquids that the barrrel of the hole comes in contact with after the holes are drilled can be deposited within and along the glass weave. When the board is powered and moisture is present - you get electrochemical migration. This shows up very quickly in areas with narrow spacings but will occur in larger spaces eventially. As you can see it is a concern of mine also and it's really bad when you pick it up in a loaded board Susan Mansilla Robisan Laboratory ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################