We're trying to determine a process sequence to accomplish the following
board finish:
-Selective Ni/Au (some are through holes)
-SMOBC
-HAL on non-gold conductors

The main problem would be the masking of the gold areas (with through holes)
prior to HAL.

Thanks for any suggestions-

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################