**ERROR** LONG FROM FIELD. FIELD WAS CUT. OLD FIELD WAS: [log in to unmask], [log in to unmask], [log in to unmask], 93059@ns0 .donau.de, [log in to unmask] ALL I am working on a kind of specification which should desribe the polyimide surface of chip passivation. The chip will assemble in Flip Chip and the polyimide must guarantee a good adhesion to epoxy underfiller. Any input is welcome to necessary parameters which should be describe and why. Regards Achim ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional info rmation. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-970 0 ext.311 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################