Dear Mr.Jeremias Here the list you asked for: - Flip-chip BGA assembly process and reliability improvements Patrick Thomson; Motorola IEMT 96 -High reliable FC-PBGA Yoshihiro Ishida; Citizen Watch IEMT 96 -Assembly and reliability of thermally enhanced High I/O BGA Packages T.I. Ejim; Lucent Technologies IEMT 97 -Product oriented BGA manufacturability and reliability study Bill Oberlin; Tandem Computers IEMT 97 - Thermal enhancement and reliability of 40mm EPBGA Packages with interface materials Zeki Z. Celik; LSI Logic IEMT 97 Best regards G.Grossmann ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################