Daan Reliability data of BGA's is not always reliable and difficult to transform to your needs. - Be aware that the data you get is from the solderballs at the corners of the chip in the BGA not from the periphery of the device - Often not the solderballs but internal connections may cause problems - I don't believe in the results derived from thermal shock tests However there is always some reliability data for BGA's presented at the IEMT in Austin Texas. Have a look in their proceedings. Best Regards Guenter ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################