Message-ID: <[log in to unmask]>
From: "Rose, Steve M" <[log in to unmask]>
To: "[log in to unmask]" <[log in to unmask]>
Subject: microvoids
Date: Tue, 4 Nov 1997 10:24:44 -0500
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Steven Rose
SP-DV-01-1
222-1791



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Message-ID: <[log in to unmask]>
From: "Rose, Steve M" <[log in to unmask]>
To: "'mail [log in to unmask]" <[log in to unmask]>
Subject: Microvoids IPC 600 to 610
Date: Tue, 4 Nov 1997 09:32:27 -0500
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In the IPC 600 standards, there is mention of microvoids and
acceptability thereof (rev e, page 11).  However, continuing on into
assembly, IPC610 standards, there is no mention of microvoids.  Is this
to say that microvoids are only accountable at the bare board level?
What about the fully assembled board?  Please advise.

Thank you
Steven Rose
SP-DV-01-1
222-1791



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