Message-ID: <[log in to unmask]> From: "Rose, Steve M" <[log in to unmask]> To: "[log in to unmask]" <[log in to unmask]> Subject: microvoids Date: Tue, 4 Nov 1997 10:24:44 -0500 X-Priority: 3 MIME-Version: 1.0 X-Mailer: Internet Mail Service (5.0.1458.49) Content-Type: multipart/mixed; boundary="---- =_NextPart_002_01BCE90D.E8B42CE0" ------ =_NextPart_002_01BCE90D.E8B42CE0 Content-Type: text/plain Steven Rose SP-DV-01-1 222-1791 > > ------ =_NextPart_002_01BCE90D.E8B42CE0 Content-Type: message/rfc822 Message-ID: <[log in to unmask]> From: "Rose, Steve M" <[log in to unmask]> To: "'mail [log in to unmask]" <[log in to unmask]> Subject: Microvoids IPC 600 to 610 Date: Tue, 4 Nov 1997 09:32:27 -0500 X-Priority: 3 MIME-Version: 1.0 X-Mailer: Internet Mail Service (5.0.1458.49) Content-Type: text/plain In the IPC 600 standards, there is mention of microvoids and acceptability thereof (rev e, page 11). However, continuing on into assembly, IPC610 standards, there is no mention of microvoids. Is this to say that microvoids are only accountable at the bare board level? What about the fully assembled board? Please advise. Thank you Steven Rose SP-DV-01-1 222-1791 ------ =_NextPart_002_01BCE90D.E8B42CE0--