I would like to know what approach companies are taking for inspecting the paste printing process. Are you using an in-line system? What equipment are you using? What are you inspecting - height, area, and volume? 100% inspection of every board built? Inspect only prototypes and random sampling of mature product? Product complexity - ultra fine pitch (0.4 mm), BGA's, micro BGA's? Product volume and mix? Benefits - defect reduction and rework time savings? Please send your comments via email to the following address. [log in to unmask] Thanks for your input. Natalie Sharp Process Engineer Newbridge Networks Kanata, ON ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################