Hello technetters, 1- What is the typical surface tension values for copper electroplating solution ? 2- What is the smallest hole size processed with the above mentioned values ? 3- What is the smallest line width (Pattern plate) ? 4- Does anyone uses surfactants or wetters along with plating additives to lower the surface tension ? 4.A - If yes, which product is used and what is the concentration range ? 5- Any negative impact on physical characteristics of plated copper ? Thank you in advance for responding, Regards, Charles Desroches Technical Advisor Viasystems Canada inc. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################