Hi Gavin, You are not clear whether you talk about the adhesion of the pad to the PCB or a solder joint to the pad. For the adhesion of copper foil to the epoxy matrix, it is the peel strength that is normally used--reason : pads are not loaded in straight-up tension, but in some sort of peeling mode. A typical requirement is about 6 lb/in; that is if your pad is peeled along its long dimension and it is 25 mils wide, you should need something like 0.15 lb of peel force. On the other hand, when component leads soldered to pads are pulled (the pad is somewhatpeeled/pulled because of the assymetric attachment of the leads, you get something in the range of 2000 to 5000 grams before failure which is typically in the solder. I hope this helps. Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 904-437-8747, Fax: 904-437-8737 E-mail: [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################