We are looking at an alternative component replacement for one of our
existing part numbers. The component is a 1206 chip capacitor. The
termination finish on the spec sheets of the existing part is defined as

Base Metallization  -  Silver
Barrier Layer - Nickel
Final Tinned Layer ( 100% Tin)

The replacement part has

Base Metallization - Silver
Barrier Layer - Copper
Final Layer of Solder

The part will go through wave soldering. Is there going to be a
solderability issue?  I have read that the barrier layer's role is to avoid
dissolving into the base mteal and form intermetallics. Is this correct? I
would appreciate if someone would explain the use of different base layers
and their functionality? Silver vs Copper?


thanks


Nasir Hanif
Plexus
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