We are looking at an alternative component replacement for one of our existing part numbers. The component is a 1206 chip capacitor. The termination finish on the spec sheets of the existing part is defined as Base Metallization - Silver Barrier Layer - Nickel Final Tinned Layer ( 100% Tin) The replacement part has Base Metallization - Silver Barrier Layer - Copper Final Layer of Solder The part will go through wave soldering. Is there going to be a solderability issue? I have read that the barrier layer's role is to avoid dissolving into the base mteal and form intermetallics. Is this correct? I would appreciate if someone would explain the use of different base layers and their functionality? Silver vs Copper? thanks Nasir Hanif Plexus [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################