Technetters: Have a two part question. First for OEM’s: Do you specify the location of surface mount features relative to each other with coordinate dimension tolerance or positional tolerance and if so what is that tolerance? For instance, a board 14” X 18”, using a surface mount pad in one corner as the 0-0 and measure the distance to a surface mount in the opposite corner, what is the tolerance on that dimension that you would specify? For Fabricators: What tolerance can you hold in the scenario describe. Also as a general rule do you compensate the outer layer artwork for shrink or growth factor along with etch compensation. This question revolves around the board and the solder paste stencil matching one to one. Thanks for your help. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################