Technetters:

Have a two part question.  First for OEM’s:
Do you specify the location of surface mount features relative to each
other with coordinate dimension tolerance or positional tolerance and if
so what is that tolerance?  For instance, a board 14” X 18”, using a
surface mount pad in one corner as the 0-0 and measure the distance to a
surface mount in the opposite corner, what is the tolerance on that
dimension that you would specify?

For Fabricators:
What tolerance can you hold in the scenario describe.  Also as a general
rule do you compensate the outer layer artwork for shrink or growth
factor along with etch compensation.

This question revolves around the board and the solder paste stencil
matching one to one.  Thanks for your help.

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