Aric, Why did you pick a Urethane over a silicon or epoxy? We use the 85/85 because our device is packaged similar to a IC. Its dimensions are 1"x 0.5" x 0.5" (L x W x H). Most IC manufacturers use this 85/85 test setup. The above comments are of my own opinion, and not necessarily that of my employer. http://www.hadco.com:8080 Dave Hoover (aka, Groovy) NPI Mgr HADCO TC2 Watsonville, CA >From: Aric J Parr <[log in to unmask]> >To: David Hoover <[log in to unmask]> >Subject: Re: [TECHNET] ASSY:PCB Assy that is Potted >Date: Thursday, October 16, 1997 5:44 AM > How hot is the iron used to solder the pins. A hot iron (or >excessive > contact time) could lift traces/delaminate solder mask.We use >MetCal Irons which are supposed to self regulate the temperature and >avoid this problem. > > Also, how clean is the PCB prior to solder mask adhesion. It could >be > a PCB fab issue.We check the fabs of every lot with a ionograph. >Readings have never exceeded 5ug. on any lot. > > We assemble, solder terminals and pot (with Urethane) large >quantities > of units each year, and don't have this particular problem, >although > 85/85 is not a normal test condition.What test conditions do you >use?