Does anyone have an idea or practical experience of how mechanically
drilled blind via holes could be covered impeccably?

Trapped air and insufficient solvent circulation prevented us (up to
now) from completely filling or covering blind vias having aspect ratios
larger than 1:1; irrespective of whether we were using solder resist,
HASL or chemical nickel and gold.

Thank you

Fritz Steiner
Dyconex Ltd, Zurich, Switzerland
http://www.dyconex.com

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